Semiconductor package with isolated heat spreader

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11923281
APP PUB NO 20220238424A1
SERIAL NO

17719246

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Abstract

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A semiconductor package includes a metallic pad and leads, a semiconductor die attached to the metallic pad, the semiconductor die including an active side with bond pads opposite the metallic pad, a wire bond extending from a respective bond pad of the semiconductor die to a respective lead of the leads, a heat spreader over the active side of the semiconductor die with a gap separating the active side of the semiconductor die from the heat spreader, an electrically insulating material within the gap and in contact with the active side of the semiconductor die and the heat spreader; and mold compound covering the semiconductor die and the wire bond, and partially covering the metallic pad and the heat spreader, with the metallic pad exposed on a first outer surface of the semiconductor package and with the heat spreader exposed on a second outer surface of the semiconductor package.

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Patent Owner(s)

  • AGILENT TECHNOLOGIES TEXAS INSTRUMENTS INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arora, Vivek Kishorechand San Jose, US 30 40
Kim, Woochan San Jose, US 120 680
Poddar, Anindya Sunnyvale, US 88 732

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