Computer implemented method and program for automating flip-chip bump layout in integrated circuit package design

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6581189
SERIAL NO

09007138

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A digital computer automatically converts an input representation of a pattern of flip-chip integrated circuit interconnect bumps in a format suitable for a circuit design program into an output representation in a format suitable for a package design program. A converter program is adapted by script files to convert the input representation into an intermediate representation in a format suitable for a mechanical design program in which only a layer which includes the bumps is extracted from the input representation which can include a substantial number of layers. A mechanical design program is adapted by scripts to automatically input the intermediate representation, identify and label the interconnects, and create the output representation in which the interconnects are labeled. The mechanical design program can be further adapted by scripts to rotate, mirror and/or shrink the pattern. A package design program inputs the output representation and draws the labeled interconnects. A comparator program compares the output representation with a previously created output representation to identify differences therebetween.

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tain, Alexander C Milipitas, CA 7 79

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