System in package with interconnected modules

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11817438
APP PUB NO 20200227393A1
SERIAL NO

16247336

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Abstract

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Embodiments include systems in packages (SiPs) and a method of forming the SiPs. A SiP includes a package substrate and a first modularized sub-package over the package substrate, where the first modularized sub-package includes a plurality of electrical components, a first mold layer, and a redistribution layer. The SiP also includes a stack of dies over the package substrate, where the first modularized sub-package is disposed between the stack of dies. The SiP further includes a plurality of interconnects coupled to the stack of dies, the first modularized sub-package, and the package substrate, wherein the redistribution layer of the first modularized sub-package couples the stack of dies to the package substrate with the plurality of interconnects. The SiP may enable the redistribution layer of the first modularized sub-package to couple the electrical components to the stacked dies and the package substrate without a solder interconnect.

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Patent Owner(s)

  • INTEL CORPORATIOND

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dominguez, Juan E Gilbert, US 44 651
Khalaf, Bilal Folsom, US 21 46
Kim, Hyoung Il Folsom, US 45 152
Meyers, John G Sacramento, US 19 106

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