Pixel, multi-pixel LED module and method of manufacture
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United States of America Patent
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Dec 5, 2023
Grant Date -
Feb 18, 2021
app pub date -
May 8, 2019
filing date -
May 9, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
In an embodiment a pixel for a multi-pixel LED module includes a first light-emitting semiconductor chip having a first upper chip side and a first lead-frame section having a first upper side, a first contacting protrusion and a second contacting protrusion, wherein the first contacting protrusion and the second contacting protrusion extend from the first upper side, and wherein the first light-emitting semiconductor chip is embedded in an electrically insulating material such that the first upper side is covered by the electrically insulating material and the first upper chip side and the contacting protrusions are exposed.
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