Semiconductor package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8829632
APP PUB NO 20120313203A1
SERIAL NO

13486220

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A semiconductor package includes a wiring board, an electronic component mounted on the wiring board, and an enclosing frame arranged on an upper surface of the electronic component. The enclosing frame includes a basal portion, which has the form of a closed frame and extends along the upper surface of the electronic component, and an adhesion portion, which is wider than the basal portion and is arranged on the upper surface of the basal portion. A cap is adhered to an upper surface of the adhesion portion. A molding resin contacts a lower surface of the adhesion portion and seals the electronic component and the wiring board that are exposed from the enclosing frame.

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First Claim

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Patent Owner(s)

  • SHINKO ELECTRIC INDUSTRIES CO., LTD.

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fuse, Masayuki Nagano, JP 1 20
Matsuzawa, Satoshi Nagano, JP 11 89

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