Apparatus and method for predetermined component placement to a target platform
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United States of America Patent
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Jan 1, 2013
Grant Date -
May 26, 2011
app pub date -
May 13, 2010
filing date -
Feb 11, 2005
priority date (Note) -
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Abstract
The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.
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