Bare die testing
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United States of America Patent
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-
Jul 28, 1998
Issued Date -
N/A
app pub date -
Apr 1, 1996
filing date -
Jul 2, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A testing apparatus for testing integrated circuits at the bare die stage includes a testing station at which microbumps of conductive material are located on interconnection trace terminations of a multilayer interconnection structure, these terminations being distributed in a pattern corresponding to the pattern of contact pads on the die to be tested. To facilitate testing of the die before separation from a wafer using the microbumps, the other connections provided to and from the interconnection structure have a low profile.
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