Material-saving resist spinner and process
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United States of America Patent
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-
Jan 3, 1995
Issued Date -
N/A
app pub date -
Jan 25, 1994
filing date -
Mar 22, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Spin coating of resist on a semiconductor wafer is done in a controlled chamber, starting with introducing a resist solvent vapor into the chamber from a nozzle or an adjacent chamber, applying the resist by spraying a very thin layer of the resist material and then removing solvent from the chamber. The result is a saving in resist material and enhanced coating uniformity.
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