Method of manufacturing thick dielectric pattern and method of manufacturing image displaying apparatus
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United States of America Patent
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Feb 3, 2009
Grant Date -
Jan 5, 2006
app pub date -
Jun 27, 2005
filing date -
Jun 30, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of manufacturing a thick dielectric pattern disposed on a substrate. A first precursor layer is formed by imparting a first photosensitive dielectric paste, including a dielectric material, onto a substrate and drying it. A second precursor layer is formed by imparting a second photosensitive dielectric paste, including a dielectric material higher in softening point than the dielectric material included in the first photosensitive dielectric paste, on the first precursor layer and drying it. Precursor patterns are formed by collectively exposing and developing the layered products of the first precursor layer and the second precursor layer through the mask of a predetermined pattern, and a thick dielectric pattern is formed by collectively baking the precursor patterns.
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