Integrated magnetic core inductors on glass core substrates

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United States of America Patent

PATENT NO 11538617
SERIAL NO

16024593

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Abstract

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A microelectronics package comprising a package core and an inductor over the package core. The inductor comprises a dielectric over the package core. The dielectric comprises a curved surface opposite the package core. At least one conductive trace is adjacent to the package core. The at least one conductive trace is at least partially embedded within the dielectric and extends over the package core. A magnetic core cladding is over the dielectric layer and at least partially surrounding the conductive trace.

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Patent Owner(s)

  • INTEL CORP.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bharath, Krishna Chandler, US 62 281
Elsherbini, Adel Chandler, US 97 297

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