Semiconductor device package with isolated semiconductor die and electric field curtailment

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11621215
SERIAL NO

17538841

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Importance

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Abstract

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In a described example, an apparatus includes: a lead frame having a first portion and having a second portion electrically isolated from the first portion, the first portion having a side surface normal to a planar opposite surface, and having a recessed edge that is notched or chamfered and extending between the side surface and a planar device side surface; a spacer dielectric mounted to the planar device side surface and partially covered by the first portion, and extending beyond the first portion; a semiconductor die mounted to the spacer dielectric, the semiconductor die partially covered by the spacer dielectric and extending beyond the spacer dielectric; the second portion of the lead frame comprising leads coupled to the semiconductor die by electrical connections; and mold compound covering the semiconductor die, the electrical connections, the spacer dielectric, and partially covering the first portion and the second portion.

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Patent Owner(s)

  • AGILENT TECHNOLOGIES TEXAS INSTRUMENTS INCORPORATED

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tuncer, Enis Dallas, US 47 101

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