Guard ring for TGZM processing
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United States of America Patent
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-
Nov 18, 1980
Grant Date -
N/A
app pub date -
Dec 7, 1978
filing date -
Dec 7, 1978
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A guard ring for processing a wafer of semiconductor material by thermal gradient zone melting has a beveled internal wall surface for supporting the wafer therein. The thickness of the guard ring is about twice the thickness of the wafer.
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