Method of manufacturing semiconductor device, semiconductor device, display device, and electronic instrument
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United States of America Patent
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Sep 21, 2010
Grant Date -
Nov 9, 2006
app pub date -
Mar 29, 2006
filing date -
Mar 30, 2005
priority date (Note) -
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Abstract
A method of manufacturing a semiconductor device includes: forming a plurality of regions extending in a predetermined direction on a substrate; and ejecting a liquid material on the plurality of regions to form an electrically conductive film, wherein the electrically conductive film extends in the same direction as the plurality of regions so as to overlap the plurality of regions.
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