Semiconductor device manufacturing method and design support apparatus
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United States of America Patent
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Oct 25, 2011
Grant Date -
Jul 29, 2010
app pub date -
Jan 21, 2010
filing date -
Jan 23, 2009
priority date (Note) -
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Abstract
A semiconductor device manufacturing method includes: forming a conductive film over a substrate; forming an assist pattern on the conductive film; forming a metal film to cover the conductive film and the assist pattern; etching back the metal film to form at least one side wall film on a side surface of the assist pattern; removing the assist pattern; forming at least one resist pattern to selectively expose a portion of the conductive film and a portion of the side wall film; performing etching using the resist pattern as a mask to remove the exposed portion of the side wall film; and etching the conductive film using the side wall film as a mask to form a gate electrode and a contact region electrically connected to the gate electrode.
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