Reactive hot-melt adhesive and/or sealing composition and method of using same
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United States of America Patent
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Feb 24, 1998
Grant Date -
N/A
app pub date -
Jun 5, 1996
filing date -
Aug 18, 1994
priority date (Note) -
Expired
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Abstract
A reactive hot melt adhesive and/or sealing composition having a heat of crystallization in joules/gram of -2 or lower, comprising a curable heat-flowable adhesive material and a particulate filler, wherein said composition has a thermal conductivity of less than 0.30 W/m..degree.C. The invention also relates to a method of using the adhesive/sealer composition described herein to fill a cavity or recess in a substrate and the filled substrates formed thereby.
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