Composition and method for improving the surface insulation resistance of a printed circuit
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United States of America Patent
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May 4, 1993
Grant Date -
N/A
app pub date -
Mar 17, 1992
filing date -
Mar 17, 1992
priority date (Note) -
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Abstract
After the stripping or etching away of metal to expose surface areas of insulating resin material in a printed circuit process based upon metal-clad insulating substrate material, the exposed surface areas of insulating material are contacted with a liquid treatment composition, comprised of an aqueous acidic solution containing fluoride ion, effective to remove from the surface areas residual metal species otherwise associated therewith, such that the surface insulation resistance afforded by the insulating surface areas of the printed circuit is improved.
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