Land pattern for 0201 components on a 0.8 mm pitch array
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 24, 2014
Grant Date -
Jul 5, 2012
app pub date -
Jan 4, 2011
filing date -
Jan 4, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A land pattern for 1 mm and 0.8 mm pitch arrays has been disclosed for placing two port devices. The land pattern includes a ball grid array (BGA) of BGA pads each connected to a respective through hole via, and a pair of rectangular conductive pads electrically connected to a an adjacent pair of through hole vias, wherein each rectangular pad extends out from its via towards the other via of the pair along a line connecting the centers of said adjacent pair vias. A solder mask is located on the rectangular pad side and has apertures over each rectangular conductive pad. The land pattern is particularly useful for locating two port devices directly underneath a BGA device while minimizing the distance from a BGA ball to the two port device lead.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully