Resist pattern-forming method, and radiation-sensitive resin composition

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United States of America Patent

PATENT NO 8795954
APP PUB NO 20130224666A1
SERIAL NO

13861416

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A resist pattern-forming method includes coating a radiation-sensitive resin composition on a substrate to provide a resist film. The resist film is exposed. The exposed resist film is developed using a developer solution including no less than 80% by mass of an organic solvent. The radiation-sensitive resin composition includes a polymer and a radiation-sensitive acid generator. The polymer has a weight average molecular weight in terms of the polystyrene equivalent of greater than 6,000 and includes a first structural unit that includes an acid-labile group. The polymer includes less than 5 mol % or 0 mol % of a second structural unit that includes a hydroxyl group.

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Patent Owner(s)

  • JSR CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Furukawa, Taiichi Tokyo, JP 29 100
Hori, Masafumi Tokyo, JP 27 116
Kimura, Reiko Tokyo, JP 8 93
Sakakibara, Hirokazu Tokyo, JP 40 195

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