Semiconductor device package and method of manufacturing the same

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United States of America Patent

PATENT NO 10903151
SERIAL NO

15987622

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Abstract

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A semiconductor substrate includes a dielectric layer, a first conductive layer, a first barrier layer and a conductive post. The dielectric layer has a first surface and a second surface opposite to the first surface. The first conductive layer is disposed adjacent to the first surface of the dielectric layer. The first barrier layer is disposed on the first conductive layer. The conductive post is disposed on the first barrier layer. A width of the conductive post is equal to or less than a width of the first barrier layer.

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Patent Owner(s)

  • ADVANCED SEMICONDUCTOR ENGINEERING INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lu, Wen-Long Kaohsiung, TW 90 201

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