Fingerprint sensor package and smartcard including the same

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United States of America Patent

PATENT NO 11538268
SERIAL NO

17500434

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A fingerprint sensor package includes a package substrate including an upper surface in which a sensing region and a peripheral region surrounding the sensing region are defined, and a lower surface facing the upper surface; a plurality of first sensing patterns located are arranged in the sensing region, are apart from each other in a first direction, and extend in a second direction crossing the first direction; a plurality of second sensing patterns that are arranged in the sensing region, are apart from each other in the second direction, and extend in the first direction; a coating member covering the sensing region; an upper ground pattern in the peripheral region and apart from the coating member to surround the coating member in the first and second directions; and a controller chip on the lower surface of the package substrate; and a plurality of capacitors.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO. LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Hyuntaek Cheonan-si, KR 2 2
Choi, Inho Seoul, KR 62 282
Lee, Kwangjin Bucheon-si, KR 18 151
Lim, Jaehyun Hwaseong-si, KR 577 4096
Park, Younghwan Hwaseong-si, KR 44 111

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