Method and system for machining an array of components
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United States of America Patent
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Aug 7, 2012
Grant Date -
Sep 25, 2008
app pub date -
Mar 21, 2007
filing date -
Mar 21, 2007
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The invention provides an enhanced method and system for machining an array of components. A holding mechanism is provided for holding an array of components in a machining process. The holding mechanism comprises: a rigid base plate and at least one support for holding a raw material while machining, one end of each support being coupled to the rigid base plate. The holding mechanism is further provided with a secure plate movably coupled to the rigid base plate. The secure plate is provided with one or more holding parts such as double-sided tape or guiding pins for holding the raw material. The secure plate can be elevated to hold the raw material during a machining operation such as peripheral machining.
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