Acid blend for removing etch residue
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United States of America Patent
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Feb 11, 2003
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app pub date -
Aug 2, 2000
filing date -
Jun 29, 1999
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Abstract
A method for removing organometallic and organosihicate residues remaining after a dry etch process from semiconductor substrates. The substrate is exposed to a conditioning solution of phosphoric acid, hydrofluoric acid, and a carboxylic acid, such as acetic acid, which removes the remaining dry etch residues while minimizing removal of material from desired substrate features. The approximate proportions of the conditioning solution are typically 80 to 95 percent acetic acid, 1 to 15 percent phosphoric acid, and 0.01 to 5.0 percent hydrofluoric acid.
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