Heat sink assembly and method of attaching a heat sink to an electronic device on a motherboard
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United States of America Patent
Stats
-
Jan 2, 2007
Grant Date -
Dec 30, 2004
app pub date -
Jun 27, 2003
filing date -
Jun 27, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A heat sink assembly is coupled to a motherboard and an electronic device on the motherboard. The heat sink assembly includes a heat sink with an opening extending through the heat sink, and a pin that extends through the motherboard and the opening in the heat sink to couple the heat sink to the electronic device and the motherboard. A member within the opening in the heat sink is positioned between the heat sink and the pin. A method of securing a heat sink to a motherboard and an electronic device on the motherboard includes thermally coupling a heat sink to an electronic device, securing the heat sink to a motherboard using a pin that extends through an opening in the heat sink, and positioning a member between the pin and the heat sink within the opening in the heat sink.
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