Semiconductor device and manufacturing method thereof
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United States of America Patent
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Sep 14, 2010
Grant Date -
Apr 30, 2009
app pub date -
Sep 15, 2008
filing date -
Oct 24, 2007
priority date (Note) -
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Abstract
A semiconductor device includes an element formed on a substrate, at least one insulating film formed on the substrate, and a seal ring formed in the insulating film so as to surround a region where the element is formed and to extend through the insulating film. The semiconductor device further includes a void region including a void and formed in the insulating film in a region located outside the seal ring when viewed from the element.
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