Process for manufacturing semiconductor device and semiconductor component
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 12, 2001
Grant Date -
N/A
app pub date -
Dec 10, 1998
filing date -
Apr 11, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for manufacturing a semiconductor comprising the step of mounting a semiconductor component on a printed circuit board, with electrodes of the semiconductor component facing to electrodes of the printed circuit board, the step of inspecting a function as a semiconductor device with the semiconductor component being mounted on the printed circuit board, the step of bonding the electrodes of the printed circuit board and the electrodes of the mounted semiconductor component to obtain the semiconductor device when the inspection result is good, and the step of replacing at least one of the printed circuit board and the semiconductor component with another one of the same type and again inspecting the function as the semiconductor device when the inspection result is not good.
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