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United States of America Patent

PATENT NO 11817375
APP PUB NO 20200258822A1
SERIAL NO

16274562

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of making a semiconductor device includes separating a conductive structure of a leadframe into interior conductive leads using an etching process. The method includes forming a first molded structure by applying a first molding compound to a leadframe having a conductive structure, separating the conductive structure into at least two interior contact portions, attaching a semiconductor die to at least one of the interior contact portions, the at least two interior contact portions being supported by the first molding compound, and forming a second molded structure by applying a second molding compound to at least part of the semiconductor die and at least two interior contact portions.

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Patent Owner(s)

  • AGILENT TECHNOLOGIES TEXAS INSTRUMENTS INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lopez, Osvaldo Jorge Annandale, US 47 369
Luo, Tianyi Bethlehem, US 12 14
Noquil, Jonathan Almeria Bethlehem, US 39 97

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