Thermoplastic resin film

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11845865
APP PUB NO 20210061998A1
SERIAL NO

17095679

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Abstract

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The present disclosure provides a base film for an adhesive tape used in a manufacturing process of a semiconductor that can be used in a plurality of processes including a reflow process.

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Patent Owner(s)

Patent OwnerAddress
FURUKAWA ELECTRIC CO LTD6-4 OTEMACHI 2-CHOME CHIYODA-KU TOKYO 100-8322

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asanuma, Takumi Tokyo, JP 15 56
Ikeda, Hideyuki Tokyo, JP 48 341
Sugiyama, Shota Tokyo, JP 3 0

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