Method for evaluating the quality of the bond between two members utilizing thermoacoustic microscopy
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United States of America Patent
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Nov 27, 1984
Grant Date -
N/A
app pub date -
May 25, 1982
filing date -
May 25, 1982
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The subject invention relates to a method of evaluating the quality of the bond achieved between two members utilizing thermoacoustic microscopy. More particularly, thermoacoustic microscopy is used to detect and/or image the plate-mode resonant signature of bonded members to determine the quality of the bond therebetween. The method is particularly suited for analyzing the integrity of a bond between an integrated circuit die and a substrate. The subject method takes advantage of the fact that the plate-mode signature of a securely bonded die and substrate combination and a poorly bonded combination will be different. Accordingly, by detecting and/or imaging the plate-mode resonant signature of the sample the integrity of the bond can be assessed. Two techniques for carrying out the subject method are disclosed.
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