Circuit board with built-in electronic component and method for manufacturing the same
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United States of America Patent
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Mar 11, 2008
Grant Date -
Nov 2, 2006
app pub date -
Jun 28, 2006
filing date -
Jul 9, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating layer, a second wiring pattern provided on a second main surface different from the first main surface of the insulating layer, and an electronic component such as a semiconductor chip or the like provided in an internal portion of the insulating layer. The electronic component includes a first external connection terminal formed on a first surface and a second external connection terminal formed on a second surface different from the first surface. The first external connection terminal is connected electrically to the first wiring pattern, and the second external connection terminal is connected electrically to the second wiring pattern.
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