Methods for fabricating fluid injection devices
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United States of America Patent
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-
Oct 21, 2008
Grant Date -
Nov 16, 2006
app pub date -
Feb 17, 2006
filing date -
May 12, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Methods for fabricating fluid injection devices. A patterned sacrificial layer is formed on a substrate. A patterned first structural layer is formed on the substrate covering the sacrificial layer. At least one fluid actuator is formed on the structural layer. A first passivation layer is formed on the first structural covering the at least one fluid actuator. An under bump metal (UBM) layer is conformably formed on the first passivation layer. A patterned first photoresist is formed at a predetermined nozzle site and a contact opening site exposes the UBM layer. A second structural layer is formed on the UBM layer. An etching protective layer is formed on the second structural layer. The first photoresist is removed creating an opening at the nozzle site exposing the UBM layer. The UBM layer in the opening is removed.
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