Method and apparatus for rapid cooldown of annealed wafer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 10, 2007
Grant Date -
Jun 30, 2005
app pub date -
Feb 6, 2004
filing date -
Dec 30, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for annealing a semiconductor substrate. The method includes turning on at least one heat source, heating a semiconductor substrate in a chamber, turning off the at least one heat source, and cooling the semiconductor substrate in the chamber. The heating a semiconductor substrate includes absorbing an energy from the at least one heat source by the semiconductor substrate. Moreover, the cooling the semiconductor substrate includes flowing a first gas in a vicinity of at least one wall of the chamber, flowing a second gas in a vicinity of the at least one heat source, and flowing a third gas in a vicinity of the semiconductor substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully