High efficiency metal lift-off process
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United States of America Patent
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May 5, 1987
Grant Date -
N/A
app pub date -
Oct 4, 1985
filing date -
Oct 4, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An improved high efficiency metal lift-off process for removing a layer of metal at least partially covering a layer of photoresist. The method comprises forming microcracks located above the layer of photoresist in the layer of metal to be removed and providing solvent to the layer of photoresist through the microcracks.
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