Method of manufacturing package unit, package unit, electronic module, and equipment
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United States of America Patent
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Feb 21, 2023
Grant Date -
Sep 24, 2020
app pub date -
Mar 13, 2020
filing date -
Mar 22, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
A method of manufacturing a package unit, comprising: preparing a circuit board having a first region, a second region surrounding the first region, and a third region between the first and the second region; preparing a mold having a frame-shaped protruding portion surrounding a first cavity, the frame-shaped protruding portion partitioning the first cavity and a second cavity surrounding the first cavity; arranging the circuit board and the mold such that the first region of the circuit board faces the first cavity, the second region of the circuit board faces the second cavity, and a gap which communicates the first cavity and the second cavity with each other is formed between the frame-shaped protruding portion and the third region of the circuit board; and forming a frame-shaped resin member on top of the second region of the circuit board by pouring a resin into the second cavity.
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