Method of making coaxial interconnection boards
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United States of America Patent
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-
Mar 20, 1990
Issued Date -
N/A
app pub date -
Jan 5, 1988
filing date -
Oct 18, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In making coaxial interconnection boards according to this invention coaxial conductors are scribed onto a circuit board substrate. The coaxial conductors are preformed and affixed in a predetermined pattern on the substrate using an adhesive. A conductive layer forming a ground plane covers the surface of the substrate interconnecting the shields of the coaxial conductors. The conductive material other than the coaxial signal conductors is eliminated around the termination points of the coaxial conductors thereby creating clearance areas. The clearance areas permit connection of the signal conductors to surface terminal pads without shorting to the shield conductors or ground planes.
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