Multi-die semiconductor package with one or more embedded die pads

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8513787
APP PUB NO 20130043574A1
SERIAL NO

13210841

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Abstract

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To avoid shorts between adjacent die pads in mounting a multi-die semiconductor package to a printed circuit board (PCB), one of the die pads is embedded in the polymer capsule, while the other die pad is exposed at the bottom of the package to provide a thermal escape path to the PCB. This arrangement is particularly useful when one of the dice in a multi-die package generates more heat than another die in the package.

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Patent Owner(s)

  • ADVANCED ANALOGIC TECHNOLOGIES, INC.;ADVANCED ANALOGIC TECHNOLOGIES (HONG KONG) LIMITED

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Keng Hung Kaohsiung, TW 17 230
Williams, Richard K Cupertino, US 343 14821

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