Modular WLCSP die daisy chain design for multiple die sizes

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11158551
APP PUB NO 20210210396A1
SERIAL NO

16736077

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A method to fabricate a modular die daisy chain design for wafer level chip scale package (WLCSP) board level reliability testing is described. A wafer is provided having pairs of solder balls electrically connected to each other by underlying metal pads. The wafer is singulated into dies of any of a plurality of sizes as required for testing. Thereafter one of the singulated dies is mounted to a test printed circuit board (PCB). The pairs of solder balls are electrically connected in a daisy chain on the test PCB.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • DIALOG SEMICONDUCTOR (UK) LIMITED

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Barclay, Duncan Swindon, GB 18 369
Belonio,, Jr Jesus Mennen Neubiberg, DE 17 21
Horsburgh, Edward Devizes, GB 1 0

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Apr 26, 2025
7.5 Year Payment $3600.00 $1800.00 $900.00 Apr 26, 2029
11.5 Year Payment $7400.00 $3700.00 $1850.00 Apr 26, 2033
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00