Resin-sealed semiconductor device
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United States of America Patent
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-
Mar 7, 2006
Grant Date -
Apr 21, 2005
app pub date -
Nov 5, 2004
filing date -
Apr 24, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A resin-sealed semiconductor device has a first semiconductor chip whose circuit surface is bonded to a surface of a die pad. The back surface of a second semiconductor chip is bonded to the back surface of the first semiconductor chip. Each of the semiconductor chips is connected by wire to outer lead respectively. A sealing resin is provided for encapsulating the die pad, the first and second semiconductor chips and the wires so that the other surface of the die pad is exposed.
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