Method for fabricating a plurality of elastic probes in a row

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7316065
APP PUB NO 20060267607A1
SERIAL NO

11364330

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of forming a plurality of elastic probes in a row is disclosed. Firstly, a substrate is provided, then, a shaping layer is formed on the substrate so as to offer two flat surfaces in parallel. A photoresist layer is formed on the substrate and on the shaping layer. Then, the photoresist layer is patterned to form a plurality of slots crossing an interface between the two flat surfaces where a plurality of elastic probes are formed in the slots. In one embodiment, the interface is an edge slope of the shaping layer so that each of the elastic probes has at least an elastic bending portion. During chip probing, the shifting direction of the elastic probes due to overdrives is perpendicular to the arranging direction of the bonding pads so that the elastic probes are suitable for probing chips with high-density and fine-pitch bonding pads.

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Patent Owner(s)

  • CHIPMOS TECHNOLOGIES (BERMUDA) LTD.;CHIPMOS TECHNOLOGIES INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chao, Yeong-Ching Tainan, TW 17 226
Huang, Hsiang-Ming Tainan, TW 27 223
Lee, Yi-Chang Tainan, TW 34 269
Liu, An-Hong Tainan, TW 52 586
Wang, Yeong-Her Tainan, TW 32 383

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