Nerve cuff electrodes fabricated using over-molded LCP substrates

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11951301
APP PUB NO 20220305254A1
SERIAL NO

17807349

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Abstract

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An electrode lead may comprise a flexible circuit that includes a planar dielectric substrate including an elongated lead substrate portion having opposing ends, an electrode carrying substrate portion disposed on one end of the lead substrate portion, and a connector substrate portion disposed on the other end of the lead substrate portion, wherein the lead substrate portion is pre-shaped into a three-dimensional structure. The flexible circuit may further include an electrically conductive trace extending from the connector substrate portion to the electrode carrying substrate portion, a first window formed in the connector substrate portion to expose the electrically conductive trace to form a connector pad, and a second window formed in the electrode carrying substrate portion to expose the electrically conductive trace to form an electrode pad. The electrode lead may further comprise a lead connector that incorporates the connector substrate portion.

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Patent Owner(s)

  • THE ALFRED E. MANN FOUNDATION FOR SCIENTIFIC RESEARCH

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ng, Boon Khai La Crescenta, US 17 39
Schmidt, Siegmar Simi Valley, US 31 240

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