Semiconductor package with heat spreader
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United States of America Patent
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-
Mar 27, 2007
Grant Date -
Jun 2, 2005
app pub date -
Oct 12, 2004
filing date -
Oct 13, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor package with heat spreader is disclosed. In one embodiment, the semiconductor package comprises a device carrier having a plurality of contact areas and a semiconductor die having a plurality of die pads of an active surface, the semiconductor die being mounted on the device carrier. Connection means to electrically connect the die pads to the contact areas and a heat spreading means mounted on the active surface of the die are provided. The heat spreading means includes an upper plate and a foot ring which protrudes from a bottom surface of the upper plate and which is positioned between the die pads on the active surface such that a cavity is formed between the heat spreading means and the active surface. The cavity is filled with an adhering means interconnecting the heat spreading means and the active surface.
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