Methods for isolating interconnects
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United States of America Patent
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Apr 24, 2001
Grant Date -
N/A
app pub date -
Dec 17, 1998
filing date -
Oct 26, 1998
priority date (Note) -
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Abstract
This present invention provides methods for isolating interconnects characterized by first isolating the top and bottom interconnects with an IMD consisting of a traditional low-k dielectric material, then dissolving the low-k material with a suitable solvent and using air or a noble gas instead of the traditional low-k dielectric material to isolate the interconnects.
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