Solder mask removal method
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United States of America Patent
Stats
-
Jul 25, 2006
Grant Date -
Jan 13, 2005
app pub date -
Jul 9, 2003
filing date -
Jul 9, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printed circuit board has a circuit trace on it and a solder mask over the circuit trace. The solder mask is removed from the printed circuit board using an ultra violet laser, to expose the circuit trace without damaging the circuit trace. A failure analysis is performed on the circuit trace of the printed circuit board.
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Cited Art Landscape
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