Method for mounting an electronic component on a preferably soft support, and resulting electronic entity, such as a passport
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United States of America Patent
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May 24, 2011
Issued Date -
N/A
app pub date -
Sep 13, 2005
filing date -
Sep 24, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
Method for mounting an electronic component, such as a silicon chip, on a support which consists in: providing an electronic component (40) having connection pads, whereof one predetermined pad (41A) is provided with a bump (42); providing a support having (30) to the predetermined pad via the bump; aligning the predetermined pad provided with the bump with the terminal; contacting the bump and the terminal and assembling them in specific temperature and pressure conditions. Prior to contacting and fixing the bump and the terminal, the surface of the terminal is covered with an insulating layer (32), the insulating layer being a material selected so as to be traversed by the bump in the temperature and pressure conditions.
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