Liquid-cooling heat dissipation device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11523537
APP PUB NO 20210195793A1
SERIAL NO

17114814

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Abstract

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A liquid-cooling heat dissipation device includes a water-cooling module, a water-tank module, a power module, a first and a second water-cooling radiators. The water-cooling module includes a base, a plate, an isolating structure and a heat-conducting unit. The isolating structure connects between the base and the plate. The plate, the isolating structure and the base define a first chamber. The isolating structure and the plate define a second and a third chambers. The first, the second and the third chambers are isolated from each other. The heat-conducting unit is partially located within the first chamber and partially exposed from the base. The first and the second water-cooling radiators connect to the plate and communicate between the water-cooling module and the water-tank module. The power module drives a medium to flow between the water-cooling module and the water-tank module through the first and the second water-cooling radiators.

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Patent Owner(s)

  • AURAS TECHNOLOGY CO., LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chien-An New Taipei, TW 210 1736
Chen, Chien-Yu New Taipei, TW 176 522
Lin, Jen-Hao New Taipei, TW 8 7
Ye, Tian-Li New Taipei, TW 14 11

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