Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system
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United States of America Patent
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Jun 17, 2003
Grant Date -
N/A
app pub date -
Jun 30, 2000
filing date -
Jun 30, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and apparatus is disclosed for polishing a semiconductor wafer. A polishing pad including a first surface and a semiconductor wafer including a second surface are aligned to each other. To allow alignment of an axis of rotation of the surfaces, at least one of the first and second surfaces includes an adjustable axis of rotation. After the axis of rotation of the first and second surfaces is aligned, the adjustable axis of rotation is set, preferably with a magneto-rheological fluid or similarly acting material, to maintain a fixed position. Thereafter, the polishing pad is utilized to polish the semiconductor wafer.
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