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United States of America Patent
Stats
-
Apr 25, 2006
Grant Date -
May 19, 2005
app pub date -
Jul 8, 2004
filing date -
Jul 23, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A filter chip lying on an upper surface of a top layer package substrate is connected to an upper surface ground electrode (235). The upper ground electrode (235) and a lower surface ground electrode (237) are connected to each other via through electrodes (261, 262, 263), ground wiring patterns (251, 252), first connecting lines (271 to 276), and second connecting lines (281, 282). The first connecting lines (271 to 276) are connected to the ground wiring patterns (251, 252), whereas the second connecting lines (281, 282) are not connected to the ground wiring patterns (251, 252), respectively. Owing to the provision of the connecting lines connected to the ground wiring patterns (251, 252) and the connecting lines unconnected to the ground wiring patterns (251, 252), the impedance between a multilayer package substrate and ground can be adjusted.
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