Chip embedded printed circuit boards and methods of fabrication

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 10980131
APP PUB NO 20190373738A1
SERIAL NO

16478080

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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The disclosure relates to systems, methods and compositions for direct printing of printed circuit boards with embedded integrated chips. Specifically, the disclosure relates to systems methods and compositions for the direct, top-down inkjet printing of printed circuit board with embedded chip and/or chip packages using a combination of print heads with conductive and dielectric ink compositions, creating predetermined dedicated compartments for locating the chips and/or chip packages and covering these with an encapsulating layer while maintaining interconnectedness among the embedded chips. Placing of the chips can be done automatically using robotic arms.

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Patent Owner(s)

  • NANO-DIMENSION TECHNOLOGIES LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kozlovski, Dan Rehovot, IL 3 7

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