Solder material, device using the same and manufacturing process thereof
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United States of America Patent
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-
Jan 6, 2004
Issued Date -
N/A
app pub date -
Dec 28, 2000
filing date -
Dec 28, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is a high-temperature solder material which is composed of tin, zinc and silver, or of 0.01 to 2 wt % germanium or aluminum and the balance tin, or tin and zinc at a ratio of 80/20 to 70/30. The tin/zinc/silver solder has a composition ratio that the ratio of till to zinc is within a range of 97/3 to 79/21 by weight, and the ratio of the sum of tin and zinc to silver is within a range of 88/12 to 50/50 by weight, or that the ratio of tin to zinc is within a range of 70/30 to 5/95 by weight, and the ratio of silver to the sum of tin, zinc and silver is 15% by weight or less. The solder material is used for producing electric or electronic devices and equipments.
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