Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

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United States of America Patent

PATENT NO 7303113
APP PUB NO 20050116013A1
SERIAL NO

10722432

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Abstract

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A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kwark, Young Hoon Chappaqua, NY 29 277
Schuster, Christian Yorktown Heights, NY 21 170

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