Hollow resin particles and sheet

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United States of America Patent

PATENT NO 11926763
APP PUB NO 20210002497A1
SERIAL NO

16981775

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is hollow resin particles having higher compressive strength and more excellent heat insulating properties and heat resistance than before. The hollow resin particles each having one or two or more hollow portions, wherein a number average particle diameter is from 0.1 μm to 9.0 μm, a void ratio is from 70% to 99%, and an amount of the volatile organic compound contained is 5% by mass or less.

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Patent Owner(s)

  • ZEON CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirata, Takeshi Tokyo, JP 27 340
Iga, Takashi Tokyo, JP 31 90
Yabuki, Nozomi Tokyo, JP 10 7

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